TSP60C20N by Texas Instruments | Memory ICs

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Manufacturer	Texas Instruments
Manufacturer's Part Number	TSP60C20N
Description	MASK ROM; Temperature Grade: OTHER; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 1 mA;
Datasheet	TSP60C20N Datasheet
In Stock	1,370

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.0002 Amp
Organization:	16KX16
Sub-Category:	MASK ROMs
Surface Mount:	NO
Maximum Supply Current:	1 mA
No. of Terminals:	28
No. of Words:	16384 words
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	CMOS
JESD-30 Code:	R-PDIP-T28
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	80 Cel
Package Code:	DIP
Memory Density:	262144 bit
Memory IC Type:	MASK ROM
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
Qualification:	Not Qualified
Package Equivalence Code:	DIP28,.6
No. of Words Code:	16K
Terminal Pitch:	2.54 mm
Temperature Grade:	OTHER

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,370	-	-

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