Texas Instruments - TSP60C81N

TSP60C81N by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TSP60C81N
Description MASK ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 1048576 bit;
Datasheet TSP60C81N Datasheet
In Stock2,662
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0001 Amp
Organization: 64KX16
Sub-Category: MASK ROMs
Surface Mount: NO
Maximum Supply Current: .3 mA
No. of Terminals: 28
No. of Words: 65536 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T28
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Memory Density: 1048576 bit
Memory IC Type: MASK ROM
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Qualification: Not Qualified
Package Equivalence Code: DIP28,.6
No. of Words Code: 64K
Nominal Supply Voltage / Vsup (V): 5
Terminal Pitch: 2.54 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 5
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