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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | V62/14608-02XE-T |
Description | MICROCONTROLLER, RISC; Temperature Grade: MILITARY; Terminal Form: BALL; No. of Terminals: 113; Package Code: VFBGA; Package Shape: SQUARE; |
Datasheet | V62/14608-02XE-T Datasheet |
In Stock | 4,242 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.8 V |
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 20 |
Surface Mount: | YES |
No. of DMA Channels: | 3 |
Address Bus Width: | 0 |
Technology: | CMOS |
Maximum Clock Frequency: | 32 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | VFBGA |
Moisture Sensitivity Level (MSL): | 3 |
No. of External Interrupts: | 16 |
Bit Size: | 16 |
DAC Channels: | NO |
Package Equivalence Code: | BGA113,12X12,20 |
PWM Channels: | YES |
Connectivity: | I2C(4), IRDA(4), SPI(8), UART(4) |
Peak Reflow Temperature (C): | 235 |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 16-Ch 12-Bit |
Terminal Pitch: | .5 mm |
CPU Family: | MSP430 |
Nominal Supply Voltage: | 3.3 V |
Maximum Seated Height: | 1 mm |
Maximum Supply Current: | 14 mA |
Terminal Finish: | TIN LEAD |
ADC Channels: | YES |
No. of Terminals: | 113 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
No. of I/O Lines: | 87 |
JESD-30 Code: | S-PBGA-B113 |
ROM Words: | 589824 |
Maximum Operating Temperature: | 125 Cel |
Width: | 7 mm |
Data EEPROM Size: | 0 |
Speed: | 25 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 3.6 V |
RAM Bytes: | 16384 |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 0 |
Peripherals: | DMA(3), RTC, TIMER(3), WDT |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -55 Cel |
Length: | 7 mm |
On Chip Program ROM Width: | 8 |
Temperature Grade: | MILITARY |