Image shown is a representation only.
| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | WL1801GYFVR |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | WL1801GYFVR Datasheet |
| In Stock | 23,178 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .575 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 130 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| JESD-30 Code: | R-PBGA-B130 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | VFBGA |
| Width: | 4.64 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Other Names: | 296-WL1801GYFVRTR |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA130,11X12,16 |
| Length: | 4.93 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
