
Image shown is a representation only.
Manufacturer | Texas Instruments |
---|---|
Manufacturer's Part Number | WL1801MODGBMOC |
Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 130; Package Code: BGA; Package Shape: RECTANGULAR; |
Datasheet | WL1801MODGBMOC Datasheet |
In Stock | 610 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.7 V |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | 2 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -20 Cel |
No. of Functions: | 1 |
No. of Terminals: | 130 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Length: | 13.4 mm |
JESD-30 Code: | R-PBGA-B130 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Width: | 13.3 mm |
Temperature Grade: | OTHER |