
Image shown is a representation only.
Manufacturer | Texas Instruments |
---|---|
Manufacturer's Part Number | XAM1707BZKB4 |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; |
Datasheet | XAM1707BZKB4 Datasheet |
In Stock | 1,273 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.14 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.2 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 2.05 mm |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Maximum Supply Current: | .3 mA |
No. of Terminals: | 256 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Address Bus Width: | 16 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B256 |
Maximum Clock Frequency: | 20 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | FBGA |
Width: | 17 mm |
Speed: | 456 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.32 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 16 |
Bit Size: | 32 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA256,16X16,40 |
Length: | 17 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .5 mm |
Power Supplies (V): | 1.3,1.8,3.3 |