Texas Instruments - XAM3872BCYE100

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XAM3872BCYE100 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number XAM3872BCYE100
Description MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;
Datasheet XAM3872BCYE100 Datasheet
In Stock1,360
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Integrated Cache: YES
Maximum Seated Height: 3.06 mm
Surface Mount: YES
No. of Terminals: 684
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 15
Technology: CMOS
JESD-30 Code: S-PBGA-B684
Maximum Clock Frequency: 30 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: FBGA
Width: 23 mm
Speed: 1000 rpm
Peripheral IC Type: MICROPROCESSOR
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
Qualification: Not Qualified
Length: 23 mm
Terminal Pitch: .8 mm
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