Texas Instruments - XCC3120MODRNMMOBR

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XCC3120MODRNMMOBR by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number XCC3120MODRNMMOBR
Description WIRELESS LAN CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 63; Package Code: LGA; Package Shape: RECTANGULAR;
Datasheet XCC3120MODRNMMOBR Datasheet
In Stock3,709
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Telecom IC Type: WIRELESS LAN CIRCUIT
Maximum Seated Height: 2.45 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 63
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 20.5 mm
JESD-30 Code: R-PBGA-N63
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Package Code: LGA
Width: 17.5 mm
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
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