Texas Instruments - XDM385AAR21F

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XDM385AAR21F by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number XDM385AAR21F
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 609; Package Code: LFBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
Datasheet XDM385AAR21F Datasheet
In Stock2,987
NAME DESCRIPTION
Minimum Supply Voltage: 1.28 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.35 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.32 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 609
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Address Bus Width: 28
Technology: CMOS
JESD-30 Code: S-PBGA-B609
Maximum Clock Frequency: 30 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: LFBGA
Width: 16 mm
Moisture Sensitivity Level (MSL): 3
Speed: 1000 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.42 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 16
Bit Size: 32
JESD-609 Code: e1
Length: 16 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
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