Texas Instruments - XDM505XXBABF

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XDM505XXBABF by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number XDM505XXBABF
Description MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 367; Package Code: BGA; Package Shape: SQUARE;
Datasheet XDM505XXBABF Datasheet
In Stock750
NAME DESCRIPTION
Minimum Supply Voltage: 1.11 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: 1.15 V
Maximum Supply Voltage: 1.2 V
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 367
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B367
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Temperature Grade: AUTOMOTIVE
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