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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | XDM505XXBABF |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 367; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | XDM505XXBABF Datasheet |
In Stock | 704 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.11 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 1.15 V |
Maximum Supply Voltage: | 1.2 V |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 367 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Screening Level: | AEC-Q100 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B367 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | BGA |
Temperature Grade: | AUTOMOTIVE |