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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | XWL1801MODGAMOCR |
| Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 130; Package Code: BGA; Package Shape: RECTANGULAR; |
| Datasheet | XWL1801MODGAMOCR Datasheet |
| In Stock | 832 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.7 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 2 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -20 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 130 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Length: | 13.4 mm |
| JESD-30 Code: | R-PBGA-B130 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 13.3 mm |
| Temperature Grade: | OTHER |
