KBG40ZPZ512G by Toshiba | Memory ICs

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Manufacturer	Toshiba
Manufacturer's Part Number	KBG40ZPZ512G
Description	FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; Surface Mount: NO; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
Datasheet	KBG40ZPZ512G Datasheet

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Memory Density:	4398046511104 bit
Organization:	512GX8
Programming Voltage (V):	1.2
Surface Mount:	NO
Memory IC Type:	FLASH MODULE
Minimum Operating Temperature:	0 Cel
Memory Width:	8
No. of Functions:	1
No. of Words:	549755813888 words
Terminal Position:	UNSPECIFIED
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Technology:	CMOS
No. of Words Code:	512G
JESD-30 Code:	R-XXMA-X
Package Shape:	RECTANGULAR
Terminal Form:	UNSPECIFIED
Operating Mode:	ASYNCHRONOUS
Nominal Supply Voltage / Vsup (V):	1.2
Additional Features:	ALSO OPERATES WITH 1.8V NOM AND 3.3V NOM SUPPLY
Maximum Operating Temperature:	85 Cel
Package Code:	XMA

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