Toshiba - MG30G2DL1

MG30G2DL1 by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number MG30G2DL1
Description NPN; Configuration: 2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Power Dissipation (Abs): 250 W; Maximum Collector Current (IC): 30 A; Maximum Operating Temperature: 150 Cel;
Datasheet MG30G2DL1 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Collector Current (IC): 30 A
Configuration: 2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
Transistor Element Material: SILICON
Transistor Application: SWITCHING
Sub-Category: BIP General Purpose Power
Polarity or Channel Type: NPN
Surface Mount: NO
Minimum DC Current Gain (hFE): 100
No. of Terminals: 6
Qualification: Not Qualified
Maximum Power Dissipation (Abs): 250 W
Maximum Collector-Emitter Voltage: 450 V
Terminal Position: UPPER
Package Style (Meter): FLANGE MOUNT
JESD-30 Code: R-PUFM-X6
No. of Elements: 2
Package Shape: RECTANGULAR
Terminal Form: UNSPECIFIED
Maximum Operating Temperature: 150 Cel
Case Connection: ISOLATED
Maximum VCEsat: 2 V
Maximum Fall Time (tf): 2000 ns
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