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Manufacturer | Toshiba |
---|---|
Manufacturer's Part Number | MG30G2DL1 |
Description | NPN; Configuration: 2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Power Dissipation (Abs): 250 W; Maximum Collector Current (IC): 30 A; Maximum Operating Temperature: 150 Cel; |
Datasheet | MG30G2DL1 Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Collector Current (IC): | 30 A |
Configuration: | 2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR |
Transistor Element Material: | SILICON |
Transistor Application: | SWITCHING |
Sub-Category: | BIP General Purpose Power |
Polarity or Channel Type: | NPN |
Surface Mount: | NO |
Minimum DC Current Gain (hFE): | 100 |
No. of Terminals: | 6 |
Qualification: | Not Qualified |
Maximum Power Dissipation (Abs): | 250 W |
Maximum Collector-Emitter Voltage: | 450 V |
Terminal Position: | UPPER |
Package Style (Meter): | FLANGE MOUNT |
JESD-30 Code: | R-PUFM-X6 |
No. of Elements: | 2 |
Package Shape: | RECTANGULAR |
Terminal Form: | UNSPECIFIED |
Maximum Operating Temperature: | 150 Cel |
Case Connection: | ISOLATED |
Maximum VCEsat: | 2 V |
Maximum Fall Time (tf): | 2000 ns |