Toshiba - T3GE9WBG(EL)

T3GE9WBG(EL) by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number T3GE9WBG(EL)
Description Other Interface ICs; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 24; Package Code: FBGA; Package Shape: SQUARE;
Datasheet T3GE9WBG(EL) Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Other Interface ICs
Surface Mount: YES
Minimum Operating Temperature: -30 Cel
No. of Terminals: 24
Qualification: Not Qualified
Package Equivalence Code: BGA24,5X5,16
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B24
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .4 mm
Temperature Grade: OTHER
Power Supplies (V): 1.8,2.9
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