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Manufacturer | Toshiba |
---|---|
Manufacturer's Part Number | TC51W3217XB-80 |
Description | PSEUDO STATIC RAM; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
Datasheet | TC51W3217XB-80 Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Organization: | 2MX16 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1.2 mm |
Minimum Supply Voltage (Vsup): | 2.5 V |
Surface Mount: | YES |
No. of Terminals: | 48 |
No. of Words: | 2097152 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B48 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 6 mm |
Memory Density: | 33554432 bit |
Memory IC Type: | PSEUDO STATIC RAM |
Minimum Operating Temperature: | -25 Cel |
Memory Width: | 16 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 9 mm |
Maximum Access Time: | 80 ns |
No. of Words Code: | 2M |
Nominal Supply Voltage / Vsup (V): | 2.75 |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 3.3 V |