TC55YD1819YB-333 by Toshiba | Memory ICs

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Manufacturer	Toshiba
Manufacturer's Part Number	TC55YD1819YB-333
Description	STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 209; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
Datasheet	TC55YD1819YB-333 Datasheet

NAME	DESCRIPTION
Package Body Material:	CERAMIC, METAL-SEALED COFIRED
Organization:	1MX18
Output Characteristics:	3-STATE
Maximum Seated Height:	2.65 mm
Minimum Supply Voltage (Vsup):	1.7 V
Sub-Category:	SRAMs
Surface Mount:	YES
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	209
Maximum Clock Frequency (fCLK):	333 MHz
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-CBGA-B209
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Width:	14 mm
Input/Output Type:	COMMON
Memory Density:	18874368 bit
Minimum Standby Voltage:	1.7 V
Memory IC Type:	STANDARD SRAM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	18
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA209,11X19,40
Length:	22 mm
Maximum Access Time:	1.6 ns
No. of Words Code:	1M
Nominal Supply Voltage / Vsup (V):	1.8
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	1.95 V
Power Supplies (V):	1.5/1.8,1.8

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