TC55YK1618XB-666 by Toshiba | Memory ICs

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Manufacturer	Toshiba
Manufacturer's Part Number	TC55YK1618XB-666
Description	STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 18;
Datasheet	TC55YK1618XB-666 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.02 Amp
Organization:	1MX18
Output Characteristics:	3-STATE
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	760 mA
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	153
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Input/Output Type:	COMMON
Memory Density:	18874368 bit
Minimum Standby Voltage:	1.71 V
Memory IC Type:	STANDARD SRAM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	18
Qualification:	Not Qualified
Package Equivalence Code:	BGA153,9X17,50
Maximum Access Time:	2 ns
No. of Words Code:	1M
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.27 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	1.5,1.8

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