TC58DAM82A1XBJ4 by Toshiba | Memory ICs

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Manufacturer	Toshiba
Manufacturer's Part Number	TC58DAM82A1XBJ4
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm;
Datasheet	TC58DAM82A1XBJ4 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00005 Amp
Organization:	32MX8
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	30 mA
Command User Interface:	YES
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	56
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B56
No. of Sectors/Size:	2K
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Memory Density:	268435456 bit
Sector Size (Words):	16K
Toggle Bit:	NO
Memory IC Type:	FLASH
JESD-609 Code:	e0
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
Page Size (words):	512
Qualification:	Not Qualified
Package Equivalence Code:	BGA56,8X12,32
Maximum Access Time:	35 ns
No. of Words Code:	32M
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Data Polling:	NO
Power Supplies (V):	1.8,3.3

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