TC58NYM9S3EBAI3 by Toshiba | Memory ICs

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Manufacturer	Toshiba
Manufacturer's Part Number	TC58NYM9S3EBAI3
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
Datasheet	TC58NYM9S3EBAI3 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	64MX8
Maximum Seated Height:	1 mm
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
No. of Terminals:	63
No. of Words:	67108864 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B63
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	VFBGA
Width:	8.5 mm
Memory Density:	536870912 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Length:	13 mm
No. of Words Code:	64M
Nominal Supply Voltage / Vsup (V):	1.8
Parallel or Serial:	SERIAL
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	1.95 V

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