Toshiba - TC74HC670AP

TC74HC670AP by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number TC74HC670AP
Description STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.45 mm;
Datasheet TC74HC670AP Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4X4
Output Characteristics: 3-STATE
Maximum Seated Height: 4.45 mm
Minimum Supply Voltage (Vsup): 2 V
Sub-Category: Other Memory ICs
Surface Mount: NO
No. of Terminals: 16
No. of Words: 4 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T16
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Width: 7.62 mm
Memory Density: 16 bit
Memory IC Type: STANDARD SRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 4
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP16,.3
Length: 19.25 mm
No. of Words Code: 4
Nominal Supply Voltage / Vsup (V): 4.5
Additional Features: ADDRESS TO OUTPUT DELAY IS 245NS
Parallel or Serial: PARALLEL
Terminal Pitch: 2.54 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 6 V
Power Supplies (V): 2/6
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