Toshiba - TC7SP300WBG(EL)

TC7SP300WBG(EL) by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number TC7SP300WBG(EL)
Description NAND GATE; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: FBGA; Package Shape: RECTANGULAR;
Datasheet TC7SP300WBG(EL) Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Schmitt Trigger: NO
No. of Inputs: 2
Minimum Supply Voltage (Vsup): 1.1 V
Sub-Category: Gates
Surface Mount: YES
No. of Terminals: 6
Maximum I (ol): 9 Amp
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B6
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Propagation Delay At Nominal Supply: 37 ns
Packing Method: TR
Load Capacitance (CL): 30 pF
Logic IC Type: NAND GATE
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA6,2X3,16
Propagation Delay (tpd): 37 ns
Nominal Supply Voltage / Vsup (V): 2.5
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 2.7 V
Power Supplies (V): 1.2/2.5,1.8/3.3
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