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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | TH50VSF1481AASB |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 65; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | TH50VSF1481AASB Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 1MX16 |
| Maximum Seated Height: | 1.4 mm |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 50 mA |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 65 |
| No. of Words: | 1048576 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B65 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 9 mm |
| Memory Density: | 16777216 bit |
| Mixed Memory Type: | FLASH+SRAM |
| Memory IC Type: | MEMORY CIRCUIT |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -20 Cel |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA65,10X12,32 |
| Length: | 12 mm |
| Maximum Access Time: | 100 ns |
| No. of Words Code: | 1M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Additional Features: | SRAM IS ORGANISED AS 128K X 16 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3/3.3 |
