Toshiba - TH8D321000A

  1. Home
  2. Toshiba - TH8D321000A
TH8D321000A by Toshiba

Image shown is a representation only.

Manufacturer Toshiba
Manufacturer's Part Number TH8D321000A
Description DRAM CARD; No. of Terminals: 88; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; No. of Words Code: 1M;
Datasheet TH8D321000A Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
No. of Ports: 1
Memory Density: 33554432 bit
Organization: 1MX32
Surface Mount: NO
Memory IC Type: DRAM CARD
Memory Width: 32
No. of Functions: 1
No. of Terminals: 88
No. of Words: 1048576 words
Qualification: Not Qualified
Terminal Position: UNSPECIFIED
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
Maximum Access Time: 80 ns
No. of Words Code: 1M
JESD-30 Code: X-XXMA-X88
Package Shape: UNSPECIFIED
Terminal Form: UNSPECIFIED
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

MT48H32M16LFB4-6IT:C by Micron Technology

MT48H32M16LFB4-6IT:C

Micron Technology

Micron Technology's MT48H32M16LFB4-6IT:C is a DDR DRAM with 32MX16 organization, operating at 166 MHz. It features a very thin profile grid array package and supports common I/O type. Ideal for industrial applications requiring fast access times and low power consumption.
NT5CC64M16GP-DIH by Nanya Technology

NT5CC64M16GP-DIH

Nanya Technology

NT5CC64M16GP-DIH by Nanya Technology is a DDR3L DRAM with 64MX16 organization, operating at 800 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
MT47H128M8SH-25EIT:M by Micron Technology

MT47H128M8SH-25EIT:M

Micron Technology

Micron Technology's MT47H128M8SH-25EIT:M is a DDR2 DRAM with 128MX8 organization, operating at 400 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
EDB4432BBBJ-1D-F-R by Micron Technology

EDB4432BBBJ-1D-F-R

Micron Technology

Micron Technology's EDB4432BBBJ-1D-F-R is a 128MX32 LPDDR2 DRAM with 134 terminals in a grid array package. Operating at 1.2V, it offers synchronous mode, self-refresh capability, and multi-bank page burst access for high-speed memory applications. The very thin profile and fine pitch make it suitable for compact electronic devices requiring fast and efficient data processing.
MT41K1G8RKB-107:P by Micron Technology

MT41K1G8RKB-107:P

Micron Technology

Micron Technology's MT41K1G8RKB-107:P is a DDR3L DRAM with 1GX8 organization, operating at 1.35V. It features synchronous operation, self-refresh capability, and dual bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in devices like smartphones, tablets, and laptops.
W989D6DBGX6E by Winbond Electronics

W989D6DBGX6E

Winbond Electronics

W989D6DBGX6E by Winbond Electronics is a 32MX16 SDRAM with 536MB memory density. Operating at 1.8V, it offers synchronous self-refresh mode and fast access time of 5ns. Ideal for applications requiring high-speed data processing in compact devices like smartphones and tablets.
MT53E512M32D1ZW-046AUT:B by Micron Technology

MT53E512M32D1ZW-046AUT:B

Micron Technology

MT53E512M32D1ZW-046AUT:B by Micron Technology is a 512MX32 LPDDR4 DRAM with a clock frequency of 2133 MHz. It operates synchronously, has a common input/output type, and is suitable for applications requiring high memory density and low power consumption.
MT40A512M16LY-062EAUT:E by Micron Technology

MT40A512M16LY-062EAUT:E

Micron Technology

Micron Technology's MT40A512M16LY-062EAUT:E is a DDR4 DRAM with 512MX16 organization, operating at 1.2V. It features synchronous mode, self-refresh capability, and automotive temperature grade. Suitable for applications requiring high memory density and fast data access in automotive electronics.
MT48LC8M16A2TG-7EIT:G by Micron Technology

MT48LC8M16A2TG-7EIT:G

Micron Technology

Micron Technology's MT48LC8M16A2TG-7EIT:G is a 3.3V, 8MX16 Synchronous DRAM with 143 MHz clock frequency and -40 to 85°C operating range. It features 4-bank page burst access mode, ideal for industrial applications requiring high-speed memory performance.
W631GG6NB-12 by Winbond Electronics

W631GG6NB-12

Winbond Electronics

Winbond Electronics' W631GG6NB-12 is a DDR3 DRAM with 64MX16 organization, operating at up to 800 MHz. It features a 96-terminal grid array package suitable for synchronous applications. With a low standby current of 0.04 Amp and common I/O type, it's ideal for high-speed memory requirements in various electronic devices.
MT40A256M16LY-062EIT:FTR by Micron Technology

MT40A256M16LY-062EIT:FTR

Micron Technology

Micron Technology's MT40A256M16LY-062EIT:FTR is a DDR4 DRAM with 256MX16 organization, operating at up to 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices such as servers, PCs, and networking equipment.
MT46V16M16P-5BIT:K by Micron Technology

MT46V16M16P-5BIT:K

Micron Technology

Micron Technology's MT46V16M16P-5BIT:K is a DDR1 DRAM with 16MX16 organization, operating at 200 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
MT40A4G8NEA-062E:F by Micron Technology

MT40A4G8NEA-062E:F

Micron Technology

MT40A4G8NEA-062E:F by Micron Technology is a DDR4 DRAM with 4GX8 organization, operating at up to 1600 MHz. It features a thin profile grid array package, common I/O type, and self-refresh capability. Ideal for applications requiring high-speed synchronous memory with a density of 34 Gb and low power consumption.
IS42VM16200D-75BLI by Integrated Silicon Solution

IS42VM16200D-75BLI

Integrated Silicon Solution

IS42VM16200D-75BLI by Integrated Silicon Solution is a 2MX16 Synchronous DRAM with 16-bit memory width. It operates at 1.8V, has a max access time of 6ns, and features dual bank page burst access mode. Ideal for industrial applications requiring high-speed and reliable memory performance in compact spaces.
MT40A1G8SA-062EIT:E by Micron Technology

MT40A1G8SA-062EIT:E

Micron Technology

Micron Technology's MT40A1G8SA-062EIT:E is a DDR4 DRAM with 1GX8 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Suitable for industrial applications with a temperature range of -40 to 95°C, it offers high memory density of 8589934592 bits and supports multi-bank page burst access mode.
MT61K256M32JE-21:T by Micron Technology

MT61K256M32JE-21:T

Micron Technology

Micron Technology's MT61K256M32JE-21:T is a GDDR6 DRAM with 256MX32 organization, operating at 1.25V. It features synchronous operation, self-refresh capability, and common I/O type. Suitable for applications requiring high memory density and fast data access in devices like graphics cards or gaming consoles.
M378T2863RZS-CE6 by Samsung

M378T2863RZS-CE6

Samsung

Samsung M378T2863RZS-CE6 DDR DRAM Module features 128MX8 organization, operates at 333 MHz clock frequency, and has a memory density of 1073741824 bits. Ideal for applications requiring high-speed synchronous operation with a common I/O type and self-refresh capability.
IS42S32400F-7TLI by Integrated Silicon Solution

IS42S32400F-7TLI

Integrated Silicon Solution

IS42S32400F-7TLI by Integrated Silicon Solution is a 4MX32 Synchronous DRAM with 3.3V supply, operating at up to 143MHz clock frequency. Ideal for industrial applications, it features common I/O type, self-refresh mode, and supports four-bank page burst access mode.
M393A2K43CB2-CVF by Samsung

M393A2K43CB2-CVF

Samsung

Samsung's M393A2K43CB2-CVF DDR4 DRAM module features 16GX8 organization, 1.2V supply voltage, and 137.4Gb memory density. Ideal for high-performance computing applications requiring fast data access with dual bank page burst capability in a compact MICROELECTRONIC ASSEMBLY package.
KM44C256AP-8 by Samsung

KM44C256AP-8

Samsung

Samsung's KM44C256AP-8 is a 256Kx4 DRAM with 80ns access time, operating at 5V. It features fast page access mode and 512 refresh cycles, suitable for commercial temperature grade applications. With a memory density of 1048576 bits, it offers common I/O type and through-hole terminal form.