THGBM1G7D4EBAI2 by Toshiba | Memory ICs

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Manufacturer	Toshiba
Manufacturer's Part Number	THGBM1G7D4EBAI2
Description	FLASH; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 32;
Datasheet	THGBM1G7D4EBAI2 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	4GX32
Maximum Seated Height:	1.4 mm
Programming Voltage (V):	3.3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	169
No. of Words:	4294967296 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B169
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	LFBGA
Width:	14 mm
Memory Density:	137438953472 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-25 Cel
Memory Width:	32
No. of Functions:	1
Type:	MLC NAND TYPE
Qualification:	Not Qualified
Length:	18 mm
No. of Words Code:	4G
Nominal Supply Voltage / Vsup (V):	3.3
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	3.6 V

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