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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | THGBM1G8D8EBAI2 |
| Description | FLASH; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: LFBGA; Package Shape: RECTANGULAR; Width: 14 mm; |
| Datasheet | THGBM1G8D8EBAI2 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 8GX32 |
| Maximum Seated Height: | 1.4 mm |
| Programming Voltage (V): | 3.3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 169 |
| No. of Words: | 8589934592 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B169 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 14 mm |
| Memory Density: | 274877906944 bit |
| Memory IC Type: | FLASH |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 32 |
| No. of Functions: | 1 |
| Type: | MLC NAND TYPE |
| Qualification: | Not Qualified |
| Length: | 18 mm |
| No. of Words Code: | 8G |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 3.6 V |
