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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | THGBM3G5D1FBAIE |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: TFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; |
| Datasheet | THGBM3G5D1FBAIE Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 4GX8 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| No. of Terminals: | 169 |
| No. of Words: | 4294967296 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B169 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 12 mm |
| Memory Density: | 34359738368 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Length: | 16 mm |
| No. of Words Code: | 4G |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 3.6 V |
