Toshiba - THGBMDG5D1LBAIT

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THGBMDG5D1LBAIT by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number THGBMDG5D1LBAIT
Description MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Technology: CMOS;
Datasheet THGBMDG5D1LBAIT Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Memory Density: 34359738368 bit
Organization: 4GX8
Surface Mount: YES
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -25 Cel
Memory Width: 8
No. of Functions: 1
No. of Terminals: 153
No. of Words: 4294967296 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
No. of Words Code: 4G
JESD-30 Code: R-PBGA-B153
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Temperature Grade: OTHER
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