THGBMHG6C1LBAIL by Toshiba | Memory ICs

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Manufacturer	Toshiba
Manufacturer's Part Number	THGBMHG6C1LBAIL
Description	MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet	THGBMHG6C1LBAIL Datasheet

NAME	DESCRIPTION
Other Names:	THGBMHG6C1LBAILH2H THGBMHG6C1LBAILLLL THGBMHG6C1LBAILYGJ THGBMHG6C1LBAILJLL THGBMHG6C1LBAILHLL THGBMHG6C1LBAILH20 THGBMHG6C1LBAILJLH THGBMHG6C1LBAILJ2L THGBMHG6C1LBAILALL THGBMHG6C1LBAILH2L THGBMHG6C1LBAILL2H THGBMHG6C1LBAILJ2H
Package Body Material:	PLASTIC/EPOXY
Memory Density:	68719476736 bit
Organization:	8GX8
Surface Mount:	YES
Memory IC Type:	MEMORY CIRCUIT
Minimum Operating Temperature:	-25 Cel
Memory Width:	8
No. of Functions:	1
No. of Terminals:	153
No. of Words:	8589934592 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
No. of Words Code:	8G
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Temperature Grade:	OTHER

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