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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | THGBMHG6C1LBAU6 |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1; |
| Datasheet | THGBMHG6C1LBAU6 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Memory Density: | 68719476736 bit |
| Organization: | 8GX8 |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Terminals: | 153 |
| No. of Words: | 8589934592 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| No. of Words Code: | 8G |
| JESD-30 Code: | R-PBGA-B153 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | BGA |
| Temperature Grade: | INDUSTRIAL |
