Toshiba - THGBMHG7C2LBAB7

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THGBMHG7C2LBAB7 by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number THGBMHG7C2LBAB7
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
Datasheet THGBMHG7C2LBAB7 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16GX8
Programming Voltage (V): 2.7
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 153
No. of Words: 17179869184 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: R-PBGA-B153
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Memory Density: 137438953472 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Alternate Memory Width: 4
No. of Words Code: 16G
Additional Features: ALSO ORGANISED AS 128GX1
Parallel or Serial: SERIAL
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
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