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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | THGBMHG8C2LBAIL |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 8; |
| Datasheet | THGBMHG8C2LBAIL Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
THGBMHG8C2LBAILJ4S THGBMHG8C2LBAILHJL THGBMHG8C2LBAILYFE THGBMHG8C2LBAILYHG THGBMHG8C2LBAILA4L THGBMHG8C2LBAILA4H THGBMHG8C2LBAILYGE THGBMHG8C2LBAILH4L THGBMHG8C2LBAILJ4L THGBMHG8C2LBAILH4H THGBMHG8C2LBAILYGJ THGBMHG8C2LBAILYFJ THGBMHG8C2LBAILYHL |
| Package Body Material: | PLASTIC/EPOXY |
| Memory Density: | 274877906944 bit |
| Organization: | 32GX8 |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Terminals: | 153 |
| No. of Words: | 34359738368 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| No. of Words Code: | 32G |
| JESD-30 Code: | R-PBGA-B153 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Temperature Grade: | OTHER |
