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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | THGBMHG8C4LBAB7 |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; |
| Datasheet | THGBMHG8C4LBAB7 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 32GX8 |
| Programming Voltage (V): | 2.7 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| No. of Terminals: | 153 |
| No. of Words: | 34359738368 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B153 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | BGA |
| Memory Density: | 274877906944 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Alternate Memory Width: | 4 |
| No. of Words Code: | 32G |
| Additional Features: | ALSO ORGANISED AS 256GX1 |
| Parallel or Serial: | SERIAL |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
