THGBMHG9C8LBAB8 by Toshiba | Memory ICs

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Manufacturer	Toshiba
Manufacturer's Part Number	THGBMHG9C8LBAB8
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Density: 549755813888 bit;
Datasheet	THGBMHG9C8LBAB8 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	64GX8
Programming Voltage (V):	2.7
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	153
No. of Words:	68719476736 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	105 Cel
Package Code:	BGA
Memory Density:	549755813888 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Alternate Memory Width:	4
No. of Words Code:	64G
Additional Features:	ALSO ORGANISED AS 512GX1
Parallel or Serial:	SERIAL
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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