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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | THGBMJG6C1LBAB7 |
| Description | FLASH MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm; |
| Datasheet | THGBMJG6C1LBAB7 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 8GX8 |
| Maximum Seated Height: | 1 mm |
| Programming Voltage (V): | 3.3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| No. of Terminals: | 153 |
| Maximum Clock Frequency (fCLK): | 52 MHz |
| No. of Words: | 8589934592 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B153 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | VFBGA |
| Width: | 11.5 mm |
| Memory Density: | 68719476736 bit |
| Memory IC Type: | FLASH MODULE |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Length: | 13 mm |
| No. of Words Code: | 8G |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
