Toshiba - THM88020CTS-50

  1. Home
  2. Toshiba - THM88020CTS-50
THM88020CTS-50 by Toshiba

Image shown is a representation only.

Manufacturer Toshiba
Manufacturer's Part Number THM88020CTS-50
Description DRAM MODULE; No. of Terminals: 30; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 8388608 words; Surface Mount: YES;
Datasheet THM88020CTS-50 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
No. of Ports: 1
Memory Density: 67108864 bit
Organization: 8MX8
Surface Mount: YES
Memory IC Type: DRAM MODULE
Memory Width: 8
No. of Functions: 1
No. of Terminals: 30
No. of Words: 8388608 words
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Technology: CMOS
Maximum Access Time: 50 ns
No. of Words Code: 8M
JESD-30 Code: R-PDSO-G30
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Package Code: SOP
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

IS42S32400F-6BL by Integrated Silicon Solution

IS42S32400F-6BL

Integrated Silicon Solution

IS42S32400F-6BL by Integrated Silicon Solution is a 4MX32 Synchronous DRAM with 3.3V supply, 166 MHz clock frequency, and 70°C operating temp. Ideal for applications requiring high-speed memory access in commercial-grade devices.
AS4C16M16SA-6TCN by Alliance Memory

AS4C16M16SA-6TCN

Alliance Memory

AS4C16M16SA-6TCN by Alliance Memory is a 16MX16 Synchronous DRAM with 166 MHz clock frequency. Operating at 3.3V, it offers 16777216 words memory density and supports four bank page burst access mode. Ideal for applications requiring high-speed data processing in commercial temperature environments.
AS4C512M16D3LC-12BCN by Alliance Memory

AS4C512M16D3LC-12BCN

Alliance Memory

Alliance Memory's AS4C512M16D3LC-12BCN is a DDR3L DRAM with 512MX16 organization, operating at 800 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in compact devices like smartphones and tablets.
IS43TR16256B-125KBLI-TR by Integrated Silicon Solution

IS43TR16256B-125KBLI-TR

Integrated Silicon Solution

IS43TR16256B-125KBLI-TR by Integrated Silicon Solution is a 256MX16 DDR3 DRAM with 800 MHz clock frequency. It operates synchronously, supports self-refresh, and has a common I/O type. Ideal for industrial applications requiring high memory density and fast data access speeds.
W9816G6JH-6I by Winbond Electronics

W9816G6JH-6I

Winbond Electronics

W9816G6JH-6I by Winbond Electronics is a 1MX16 Synchronous DRAM with 16-bit memory width. Operating at 3.3V, it features dual bank page burst access mode and self-refresh capability. Ideal for industrial applications requiring fast data processing in a compact package.
M393A2K43CB2-CVF by Samsung

M393A2K43CB2-CVF

Samsung

Samsung's M393A2K43CB2-CVF DDR4 DRAM module features 16GX8 organization, 1.2V supply voltage, and 137.4Gb memory density. Ideal for high-performance computing applications requiring fast data access with dual bank page burst capability in a compact MICROELECTRONIC ASSEMBLY package.
MT4C4001JDJ-6 by Micron Technology

MT4C4001JDJ-6

Micron Technology

Micron Technology's MT4C4001JDJ-6 is a 1MX4 DRAM with 1048576 words, 60ns access time, and 4194304-bit memory density. It is used in fast page applications requiring common I/O type and operates at a nominal voltage of 5V.
MT40A1G8SA-075:E by Micron Technology

MT40A1G8SA-075:E

Micron Technology

MT40A1G8SA-075:E by Micron Technology is a DDR4 DRAM with 1GX8 organization, 1073741824 words, and 8589934592 bit memory density. It operates synchronously, has self-refresh capability, and is commonly used in multi-bank page burst access mode applications.
MT41K64M16TW-107AIT:J by Micron Technology

MT41K64M16TW-107AIT:J

Micron Technology

Micron Technology's MT41K64M16TW-107AIT:J is a DDR3L DRAM with 64MX16 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and multi-bank page burst access. Ideal for applications requiring high memory density and fast data processing in a compact form factor.
M378T5263AZ3-CF7 by Samsung

M378T5263AZ3-CF7

Samsung

Samsung M378T5263AZ3-CF7 DDR DRAM Module features 512MX64 organization, operates at 400 MHz with 1.8V supply voltage. Ideal for high-performance computing applications requiring fast data processing and storage capabilities.
IS42S16400J-5TL by Integrated Silicon Solution

IS42S16400J-5TL

Integrated Silicon Solution

IS42S16400J-5TL by Integrated Silicon Solution is a 4MX16 Synchronous DRAM with 3.3V supply voltage, operating at up to 200MHz clock frequency. It features self-refresh and common I/O for various applications requiring fast memory access and high data density in a small outline package.
KM416C1000AJ-6 by Samsung

KM416C1000AJ-6

Samsung

Samsung KM416C1000AJ-6 is a 1MX16 DRAM with 1048576 words, 16-bit memory width, and 60ns access time. It operates at 5V with a max standby current of 0.001A, suitable for fast page applications in commercial temperature grades.
MT40A256M16GE-083E:B by Micron Technology

MT40A256M16GE-083E:B

Micron Technology

Micron Technology's MT40A256M16GE-083E:B is a DDR4 DRAM with 256MX16 organization, operating at 1.2V. It features synchronous mode, self-refresh capability, and multi-bank page burst access for high-speed data processing applications in electronics.
MT41K128M16JT-125AAT:K by Micron Technology

MT41K128M16JT-125AAT:K

Micron Technology

Micron Technology's MT41K128M16JT-125AAT:K is a DDR3L DRAM with 128MX16 organization, operating at 800 MHz. It features a thin profile grid array package, operates at 1.35V, and has an industrial temperature grade. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
AS4C32M16D2A-25BCN by Alliance Memory

AS4C32M16D2A-25BCN

Alliance Memory

Alliance Memory's AS4C32M16D2A-25BCN is a 32MX16 Synchronous DRAM with 536870912-bit memory density. Operating at 1.8V, it offers fast access time of 0.4ns and features self-refresh mode. Ideal for applications requiring high-speed data processing in compact devices.
K4H560838H-UCB3 by Samsung

K4H560838H-UCB3

Samsung

Samsung's K4H560838H-UCB3 DDR1 DRAM features 32MX8 organization, operates at 166 MHz clock frequency, and has a memory density of 268MB. Ideal for commercial applications requiring high-speed data processing with a max operating temperature of 70°C.
MT48LC16M16A2B4-6AAIT:G by Micron Technology

MT48LC16M16A2B4-6AAIT:G

Micron Technology

Micron Technology's MT48LC16M16A2B4-6AAIT:G is a 16MX16 DRAM with 3.3V supply voltage, operating in synchronous mode. It features a grid array package style, very thin profile, and fine pitch terminals. Ideal for industrial applications requiring fast access time and high memory density.
K4S561632J-UC75 by Samsung

K4S561632J-UC75

Samsung

Samsung's K4S561632J-UC75 is a 16MX16 DRAM with 3.3V supply, 133 MHz clock frequency, and 70°C operating temp. Ideal for applications requiring high-speed memory access in commercial-grade devices due to its small form factor, low power consumption, and fast access time of 5.4 ns.
MT48LC16M16A2P-6A:GTR by Micron Technology

MT48LC16M16A2P-6A:GTR

Micron Technology

Micron Technology's MT48LC16M16A2P-6A:GTR is a 16MX16 Synchronous DRAM with 16777216 words, 268435456 bit memory density, and 5.4 ns max access time. It operates at 3.3V, has a temperature range of 0-70°C, and is suitable for commercial applications requiring high-speed memory performance.
MT47H64M16HR-3IT:H by Micron Technology

MT47H64M16HR-3IT:H

Micron Technology

Micron Technology's MT47H64M16HR-3IT:H is a DDR2 DRAM with 64MX16 organization, operating at 333 MHz. It features a thin profile grid array package and operates in industrial temperature range. Suitable for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.