Toshiba - THM94000AL-80

  1. Home
  2. Toshiba - THM94000AL-80
THM94000AL-80 by Toshiba

Image shown is a representation only.

Manufacturer Toshiba
Manufacturer's Part Number THM94000AL-80
Description DRAM MODULE; Memory Width: 9; No. of Ports: 1; No. of Words Code: 4M; No. of Words: 4194304 words; Qualification: Not Qualified;
Datasheet THM94000AL-80 Datasheet
NAME DESCRIPTION
No. of Functions: 1
No. of Ports: 1
No. of Words: 4194304 words
Qualification: Not Qualified
Memory Density: 37748736 bit
Organization: 4MX9
Maximum Access Time: 80 ns
No. of Words Code: 4M
Memory IC Type: DRAM MODULE
Memory Width: 9
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

IS46TR16256BL-125KBLA2-TR by Integrated Silicon Solution

IS46TR16256BL-125KBLA2-TR

Integrated Silicon Solution

IS46TR16256BL-125KBLA2-TR by Integrated Silicon Solution is a DDR3L DRAM with 256MX16 organization, operating at up to 800 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data processing in a compact form factor.
W9725G6KB25I by Winbond Electronics

W9725G6KB25I

Winbond Electronics

Winbond Electronics' W9725G6KB25I is a DDR2 DRAM with 16Mx16 organization, operating at 400MHz. It features a 1.8V supply voltage, 84 terminals in a thin profile grid array package, and supports synchronous operation. Ideal for industrial applications requiring high-speed memory with common I/O type and self-refresh capability.
IS43TR16256AL-125KBL by Integrated Silicon Solution

IS43TR16256AL-125KBL

Integrated Silicon Solution

IS43TR16256AL-125KBL by Integrated Silicon Solution is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous operation, self-refresh capability, and multi-bank page burst access mode. Ideal for applications requiring high memory density and fast access times in a compact grid array package.
S27KL0642DPBHI020 by Infineon Technologies

S27KL0642DPBHI020

Infineon Technologies

S27KL0642DPBHI020 by Infineon Technologies is an 8MX8 DRAM with a memory density of 67108864 bit. Operating at up to 200 MHz, it features synchronous mode and self-refresh capability. This HYPERRAM is suitable for applications requiring high-speed data storage in compact electronic devices.
MT40A256M16GE-075E:B by Micron Technology

MT40A256M16GE-075E:B

Micron Technology

Micron Technology's MT40A256M16GE-075E:B is a DDR4 DRAM with 256MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and a memory width of 16 bits. Ideal for applications requiring high-speed data processing in commercial-grade environments.
MT53E256M32D2DS-046AUT:B by Micron Technology

MT53E256M32D2DS-046AUT:B

Micron Technology

Micron Technology's MT53E256M32D2DS-046AUT:B is a LPDDR4 DRAM with 256MX32 organization, operating at 2133 MHz. It features a very thin profile package style with 200 terminals and supports synchronous operation. Ideal for applications requiring high-speed memory access in automotive electronics due to AEC-Q100 screening level.
MT47H64M16HR-3IT:H by Micron Technology

MT47H64M16HR-3IT:H

Micron Technology

Micron Technology's MT47H64M16HR-3IT:H is a DDR2 DRAM with 64MX16 organization, operating at 333 MHz. It features a thin profile grid array package and operates in industrial temperature range. Suitable for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
MT46V16M16P-5BXIT:M by Micron Technology

MT46V16M16P-5BXIT:M

Micron Technology

Micron Technology's MT46V16M16P-5BXIT:M is a DDR1 DRAM with 16MX16 organization, 268435456 bit memory density, and 0.7 ns max access time. It operates synchronously at 2.6V and features self-refresh capability. Ideal for applications requiring high-speed data processing in compact devices.
KMM366S403CTL-G0 by Samsung

KMM366S403CTL-G0

Samsung

Samsung's KMM366S403CTL-G0 is a 4MX64 Synchronous DRAM module with 3.3V supply, operating at 100MHz clock frequency. It features self-refresh capability and offers a memory density of 268MB for applications requiring high-speed data processing in commercial temperature environments.
MT48LC8M16A2P-6AIT by Micron Technology

MT48LC8M16A2P-6AIT

Micron Technology

Micron Technology's MT48LC8M16A2P-6AIT is a 3.3V Synchronous DRAM with 8MX16 organization, operating at up to 167 MHz clock frequency. Ideal for industrial applications, it offers a memory density of 134217728 bits and supports common I/O type with self-refresh capability.
KM416V256ALT-7 by Samsung

KM416V256ALT-7

Samsung

Samsung's KM416V256ALT-7 is a 256Kx16 DRAM with 3.3V supply, operating in asynchronous mode. It features fast page access, 70ns max access time, and 512 refresh cycles. Ideal for applications requiring high-speed memory with low power consumption.
IS43TR16256BL-125KBLI-TR by Integrated Silicon Solution

IS43TR16256BL-125KBLI-TR

Integrated Silicon Solution

IS43TR16256BL-125KBLI-TR by Integrated Silicon Solution is a DDR3L DRAM with 256MX16 organization, operating at up to 800 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast data processing in a compact grid array package.
MT48LC16M16A2B4-6A:G by Micron Technology

MT48LC16M16A2B4-6A:G

Micron Technology

MT48LC16M16A2B4-6A:G by Micron Technology is a 16MX16 DRAM with 3.3V supply, operating at 167MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for commercial applications requiring fast access times and high memory density in a compact grid array package.
MSM5416273-50GS-K by Oki Electric Industry

MSM5416273-50GS-K

Oki Electric Industry

VIDEO DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: SSOP; Package Shape: RECTANGULAR; Organization: 256KX16;
MT46H32M16LFBF-6IT:B by Micron Technology

MT46H32M16LFBF-6IT:B

Micron Technology

Micron Technology's MT46H32M16LFBF-6IT:B is a DDR1 DRAM with 32MX16 organization, operating at 166 MHz. It features a very thin profile package style and offers 8192 refresh cycles. Ideal for industrial applications requiring fast memory access and low power consumption.
W3H32M64E-533SBI by Microsemi

W3H32M64E-533SBI

Microsemi

Microsemi's W3H32M64E-533SBI DDR2 DRAM features 32MX64 organization, 1.8V supply voltage, and operates synchronously. Ideal for industrial applications with a temperature range of -40 to 85°C, it offers self-refresh capability and a memory density of 2147483648 bits.
HY5DU573222FP-33 by Sk Hynix

HY5DU573222FP-33

Sk Hynix

SK Hynix's HY5DU573222FP-33 is a DDR1 DRAM with 8MX32 organization, operating at 300 MHz. It features 144 terminals in a low profile grid array package, suitable for applications requiring high-speed synchronous memory access and common I/O type. With a max clock frequency of 300 MHz and 268435456-bit memory density, it offers fast data processing capabilities for commercial-grade systems.
MB814400A-70PZ by Fujitsu

MB814400A-70PZ

Fujitsu

The Fujitsu MB814400A-70PZ is a 1MX4 DRAM with 3-STATE output, operating at 5V. It features a memory density of 4194304 bit and offers fast access with a max access time of 70ns. Ideal for commercial applications requiring high-speed memory solutions.
IS43TR16256AL-125KBLI by Integrated Silicon Solution

IS43TR16256AL-125KBLI

Integrated Silicon Solution

IS43TR16256AL-125KBLI by Integrated Silicon Solution is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous operation, self-refresh capability, and multi-bank page burst access mode. Ideal for industrial applications requiring high memory density and fast access times in a compact grid array package.
TC514400AZ-60 by Toshiba

TC514400AZ-60

Toshiba

Toshiba's TC514400AZ-60 is a 1MX4 DRAM with 1048576 words, operating at 5V. It features a max access time of 60ns and refresh cycles of 1024, suitable for commercial applications requiring fast page access in a rectangular package style.