TMP19A23FYXBG by Toshiba | Peripheral ICs

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Manufacturer	Toshiba
Manufacturer's Part Number	TMP19A23FYXBG
Description	MICROCONTROLLER, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 141; Package Code: BGA; Package Shape: SQUARE;
Datasheet	TMP19A23FYXBG Datasheet

NAME	DESCRIPTION
Minimum Supply Voltage:	1.35 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.5 V
Sub-Category:	Microcontrollers
Surface Mount:	YES
Maximum Supply Current:	58 mA
ADC Channels:	YES
No. of Terminals:	141
DMA Channels:	YES
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
No. of I/O Lines:	103
Address Bus Width:	24
Technology:	CMOS
JESD-30 Code:	S-PBGA-B141
Package Shape:	SQUARE
ROM Words:	262144
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Width:	9 mm
Speed:	40 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	1.65 V
RAM Bytes:	24576
External Data Bus Width:	16
Bit Size:	32
DAC Channels:	NO
Minimum Operating Temperature:	-20 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA141,12X12,25
Length:	9 mm
PWM Channels:	NO
ROM Programmability:	FLASH
Terminal Pitch:	.65 mm
Temperature Grade:	OTHER
Power Supplies (V):	1.5,3.3

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