Toshiba - TMP19A64C1DXBG

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TMP19A64C1DXBG by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number TMP19A64C1DXBG
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 281; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet TMP19A64C1DXBG Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.5 V
Integrated Cache: YES
Maximum Seated Height: 1.4 mm
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 60 mA
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
On Chip Data RAM Width: 8
No. of Terminals: 281
No. of Serial I/Os: 7
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
No. of DMA Channels: 8
Address Bus Width: 24
Technology: CMOS
RAM Words: 57344
JESD-30 Code: S-PBGA-B281
Maximum Clock Frequency: 13.5 MHz
Package Shape: SQUARE
ROM Words: 1536
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 13 mm
Speed: 54 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.65 V
No. of External Interrupts: 12
RAM Bytes: 57344
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 16
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -20 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA281,18X18,25
Length: 13 mm
ROM Programmability: MROM
Terminal Pitch: .65 mm
Temperature Grade: OTHER
Power Supplies (V): 1.8/3.3,3
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