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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | TYAD00AC00BUGK |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 224; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -30 Cel; |
| Datasheet | TYAD00AC00BUGK Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .01 Amp |
| Mixed Memory Type: | EEPROM+SDRAM |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -30 Cel |
| No. of Terminals: | 224 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA224,14X20,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| Maximum Access Time: | 35 ns |
| JESD-30 Code: | R-PBGA-B224 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.8,3/3.3 |
