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Manufacturer | Transcend Information |
---|---|
Manufacturer's Part Number | TS2GUSDC |
Description | FLASH; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Organization: 2GX8; |
Datasheet | TS2GUSDC Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | UNSPECIFIED |
Organization: | 2GX8 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Programming Voltage (V): | 2.7 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
No. of Words: | 2147483648 words |
Terminal Position: | UPPER |
Package Style (Meter): | UNCASED CHIP |
Technology: | CMOS |
JESD-30 Code: | R-XUUC-N |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | DIE |
Memory Density: | 17179869184 bit |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -25 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Type: | NOR TYPE |
No. of Words Code: | 2G |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 3.6 V |