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Manufacturer | Transcend Information |
---|---|
Manufacturer's Part Number | TS32GSDHC10 |
Description | FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Technology: CMOS; Peak Reflow Temperature (C): NOT SPECIFIED; |
Datasheet | TS32GSDHC10 Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | UNSPECIFIED |
Organization: | 32GX8 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Programming Voltage (V): | 2.7 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
No. of Words: | 34359738368 words |
Terminal Position: | UPPER |
Package Style (Meter): | UNCASED CHIP |
Technology: | CMOS |
JESD-30 Code: | R-XUUC-N |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | DIE |
Memory Density: | 274877906944 bit |
Memory IC Type: | FLASH CARD |
Minimum Operating Temperature: | -25 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
No. of Words Code: | 32G |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 3.6 V |