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| Manufacturer | U-blox Ag |
|---|---|
| Manufacturer's Part Number | BMD-330-A-R |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: XMA; Package Shape: RECTANGULAR; Data Rate: 2 Mbps; |
| Datasheet | BMD-330-A-R Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
1604-1024-2-ND BMD-330-A-R-00 1604-1024-1-ND 672-BMD-330-A-R-00TR-ND 1604-1024-6 672-BMD-330-A-R-00DKR-ND 672-BMD-330-A-RTR 1604-1024-2 1604-1024-6-ND BMD-330-A-R-10 1604-1024-1 672-BMD-330-A-RCT 672-BMD-330-A-R-00CT-ND 672-BMD-330-A-RDKR |
| Package Body Material: | UNSPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Data Rate: | 2 Mbps |
| JESD-30 Code: | R-XXMA-N |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 250 |
| Package Code: | XMA |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 3 |
