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| Manufacturer | Winbond Electronics |
|---|---|
| Manufacturer's Part Number | W25N02KVZEIU |
| Description | FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V; Technology: CMOS; |
| Datasheet | W25N02KVZEIU Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 256MX8 |
| Output Characteristics: | 3-STATE |
| Maximum Seated Height: | .8 mm |
| Programming Voltage (V): | 3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 35 mA |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 104 MHz |
| No. of Words: | 268435456 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-XDSO-N8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 60000 Write/Erase Cycles |
| Package Code: | HVSON |
| Width: | 6 mm |
| Serial Bus Type: | SPI |
| Memory Density: | 2147483648 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | SLC NAND TYPE |
| Package Equivalence Code: | SOLCC8,.3 |
| Length: | 8 mm |
| No. of Words Code: | 256M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Minimum Data Retention Time: | 10 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Maximum Supply Voltage (Vsup): | 3.6 V |
