W25Q32JWBYIQ by Winbond Electronics | Memory ICs

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Manufacturer	Winbond Electronics
Manufacturer's Part Number	W25Q32JWBYIQ
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 12; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
Datasheet	W25Q32JWBYIQ Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	4MX8
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	.54 mm
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
No. of Terminals:	12
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	4194304 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B12
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	VFBGA
Memory Density:	33554432 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Alternate Memory Width:	1
No. of Words Code:	4M
Nominal Supply Voltage / Vsup (V):	1.8
Peak Reflow Temperature (C):	NOT SPECIFIED
Parallel or Serial:	SERIAL
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	1.95 V

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