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| Manufacturer | Winbond Electronics |
|---|---|
| Manufacturer's Part Number | W63AH2NBVABE |
| Description | LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 178; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words: 33554432 words; |
| Datasheet | W63AH2NBVABE Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .005 Amp |
| Organization: | 32MX32 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1 mm |
| Access Mode: | MULTI BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.14 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 36 mA |
| No. of Terminals: | 178 |
| Maximum Clock Frequency (fCLK): | 800 MHz |
| No. of Words: | 33554432 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B178 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 11 mm |
| Input/Output Type: | COMMON |
| No. of Ports: | 1 |
| Memory Density: | 1073741824 bit |
| Self Refresh: | YES |
| Sequential Burst Length: | 8 |
| Memory IC Type: | LPDDR3 DRAM |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 32 |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA178,13X17,32/25 |
| Interleaved Burst Length: | 8 |
| Length: | 11.5 mm |
| No. of Words Code: | 32M |
| Nominal Supply Voltage / Vsup (V): | 1.2 |
| Additional Features: | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 1.3 V |
