Winbond Electronics - W63AH2NBVABE

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W63AH2NBVABE by Winbond Electronics

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Manufacturer Winbond Electronics
Manufacturer's Part Number W63AH2NBVABE
Description LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 178; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words: 33554432 words;
Datasheet W63AH2NBVABE Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .005 Amp
Organization: 32MX32
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.14 V
Surface Mount: YES
Maximum Supply Current: 36 mA
No. of Terminals: 178
Maximum Clock Frequency (fCLK): 800 MHz
No. of Words: 33554432 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B178
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: 11 mm
Input/Output Type: COMMON
No. of Ports: 1
Memory Density: 1073741824 bit
Self Refresh: YES
Sequential Burst Length: 8
Memory IC Type: LPDDR3 DRAM
Minimum Operating Temperature: -25 Cel
Memory Width: 32
No. of Functions: 1
Package Equivalence Code: BGA178,13X17,32/25
Interleaved Burst Length: 8
Length: 11.5 mm
No. of Words Code: 32M
Nominal Supply Voltage / Vsup (V): 1.2
Additional Features: SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 1.3 V
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