Winbond Electronics - W971GG6NB25I

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W971GG6NB25I by Winbond Electronics

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Manufacturer Winbond Electronics
Manufacturer's Part Number W971GG6NB25I
Description DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 84; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
Datasheet W971GG6NB25I Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .008 Amp
Organization: 64MX16
Output Characteristics: 3-STATE
Maximum Seated Height: 1 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
Maximum Supply Current: 140 mA
No. of Terminals: 84
Maximum Clock Frequency (fCLK): 125 MHz
No. of Words: 67108864 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B84
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 95 Cel
Package Code: VFBGA
Width: 8 mm
Input/Output Type: COMMON
No. of Ports: 1
Memory Density: 1073741824 bit
Self Refresh: YES
Sequential Burst Length: 4,8
Memory IC Type: DDR2 DRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Package Equivalence Code: BGA84,9X15,32
Interleaved Burst Length: 4,8
Length: 12.5 mm
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 1.8
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.9 V
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