Xilinx - 5962-9561701MPX

5962-9561701MPX by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number 5962-9561701MPX
Description CONFIGURATION MEMORY; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 256KX1;
Datasheet 5962-9561701MPX Datasheet
In Stock485
NAME DESCRIPTION
Package Body Material: CERAMIC, GLASS-SEALED
Organization: 256KX1
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: NO
No. of Terminals: 8
Maximum Clock Frequency (fCLK): 12.5 MHz
No. of Words: 262144 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Screening Level: MIL-STD-883
Technology: CMOS
JESD-30 Code: R-GDIP-T8
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Memory Density: 262144 bit
Memory IC Type: CONFIGURATION MEMORY
Minimum Operating Temperature: -55 Cel
Memory Width: 1
No. of Functions: 1
Qualification: Not Qualified
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: SERIAL
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 5.5 V
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