Xilinx - DL6035BG352GC

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DL6035BG352GC by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number DL6035BG352GC
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet DL6035BG352GC Datasheet
In Stock101
NAME DESCRIPTION
Minimum Supply Voltage: 3.14 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 256
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 256
Position Of Terminal: Bottom
No. of Terminals: 352
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B352
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 3.47 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
No. of Logic Cells: 1024
No. of CLBs: 1024
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA352,26X26,50
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 2.5,3.3 V
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