Xilinx - XA3S1200E-4FGG400I

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XA3S1200E-4FGG400I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XA3S1200E-4FGG400I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;
Datasheet XA3S1200E-4FGG400I Datasheet
In Stock7,564
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 2168 CLBS, 1200000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 4.88 ns
Maximum Seated Height: 2.43 mm
No. of Inputs: 304
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 232
Position Of Terminal: Bottom
No. of Terminals: 400
No. of Equivalent Gates: 1200000
Package Style (Meter): Grid Array
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B400
Maximum Clock Frequency: 572 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 19512
No. of CLBs: 2168
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA400,20X20,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 21 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Power Supplies (V): 1.2,1.2/3.3,2.5 V
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