Xilinx - XA3S400-4FTG256Q

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XA3S400-4FTG256Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XA3S400-4FTG256Q
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XA3S400-4FTG256Q Datasheet
In Stock154
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 896 CLBS, 400000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.55 mm
No. of Inputs: 264
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 264
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 400000
Package Style (Meter): Grid Array, Low Profile
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 125 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Automotive
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
No. of Logic Cells: 8064
No. of CLBs: 896
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,1.2/3.3,2.5 V
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Pricing (USD)

Qty. Unit Price Ext. Price
154 $80.350 $12,373.900

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